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Industry: Electronics Manufacturing
Resides: Salary: US $Open
Relocate: Yes
On
the Market: (Permanent
Resident of United States) Objective A challenging engineering / managerial position
in a engineering environment. Education: Master
of Science in Mechanical Engineering.
June 1995 Florida
International University, Miami, Florida. Thesis:
Characterization of gold-tin alloys as a braze material in Multichip modules. Earned
100% expenses Bachelor
of Engineering in Mechanical Engineering.
May 1989 Summary
of Qualifications Industrial •
9.5 years of Industrial experience •
Experience in all phases of process development, manufacturing, electronic
packaging (7.5 years) & mechanical design and process planning (2
years) •
Expertise in processes development in the area of MCM, high accuracy die
attach, SMT and PTH technology •
Strong Management skills. •
Experience with ISO-9002, MRP and Inventory control. Academic
and Research •
M.S in Mechanical Engineering. •
Knowledge of various technologies like thick film, thin film and MCM's •
Knowledge of software design and development •
Publications (see below) General •
Excellent communications skills •
Work well individually and in team environments Experience Process
development Engineer, (Company). October
2000 - August 2002 Establishing
processes for 10G bit Transponder product including sub contractors for
MCM packaging and Opto electronic devices (both active and passive devices). Chip and wire including both epoxy and eutectic
die attach processes. Establishing supply chain and assembly line processes
for small / medium volume manufacturing of 10 Gbit transmitter and receiver
product lines. Very proficient in high accuracy ((1 micron) eutectic die
attach and epoxy die attach processes. Product
Engineer, Lucent Technologies Inc. Breinigsville, Pa. April
2000 - October 2000 Responsible
for yield, quality, productivity of WaveStar 400G Erbium Doped Fiber Amplifier
(EDFA). Responsible to ensure products conform to customer specifications,
with in-process controls of different processes. Responsible for WaveStar
400 G product line, from kitting to shipping including, assembly, testing
in automated DWDM test platform. Handling customer complaints, in-process
failure mode analysis, leading to assembly / design improvements of the
product. Product revenue: 50 million Process
development Engineer, Lucent Technologies Inc. Breinigsville, Pa. April
1999 - April 2000 Responsible
for developing process used in assembly of fiber amplifiers. Establishing
manufacturing test / assembly systems for testing erbium doped fiber amplifiers. Group
Leader-Engineering Manager, Vitel Technologies Inc. Tucker Ga. June
1998 - April 1999 ($8million
- company: Subsidiary of American Megatrends Inc.) Responsible
for Engineering, SMT, Stockroom and Document control departments. Supervising
Engineers and technicians in the areas of process development, equipment
programming and processes for product flow through the entire factory,
with cost and quality constraints. Responsible for machine maintenance
program for the factory. Responsible for SMT production supervisors for
3 shifts of production. Developed a cost model for products. Achievements:
Maintained a consistent yield of 95% through the factory. Reduced in-process
WIP by almost 50% by incorporating continuous flow production and substantial
reduction in cycle time. Senior
Process Engineer :Vitel Technologies Inc. Tucker Ga. Aug
1996 - June 1998 Responsible
for setting up electronic manufacturing assembly line operation including
factory automation for manufacture of printed circuit board assembly using
SMT / PTH technologies. Installed surface mount assembly line worth over
$2.5 million. Setting up various processes, process capability studies
(Cp. & CpK.) using SPC tools, solder joint evaluation using x-ray
and micro-section analysis. Was responsible to get OEM approval for the
factory processes, for high volume production. Process
Engineer, Vitel Technologies Inc. Norcross Ga. June 1994 - Aug 1996 Responsible
for setting up processes for new product introduction, prototype development
and production releases. Was single point of contact for customer accounts
to take the product from "quote to cash". Work involved customer
quotes, prototype, process development and process documentation. Processes
included stencil ordering, glue process development, SMT equipment programming
and development of reflow and wave solder process. Achieved greater than
95% yield @ ICT for products Research
Assistant Florida International University, Miami, Fl. Sept
1991 - June 1994 Design
of hybrid proto's circuits using Thick and Thin film technology. Work
involved managing a Hybrid Lab equipped with a screen printer, ball bonder,
firing furnace and vacuum systems required in thin film deposition techniques
like PVD, CVD, ion implantation and cluster beam deposition. Proficient
in using analytical tools like Diffractometer, SEM, TEM, Dilatometer,
Thermal Analysis equipment (DMA, DSC & TGA) and Acoustics. Thesis
during Master's: Optimizing materials and design for hermetic sealing
enclosures compatible with Multi Chip Module (MCM) processing - The work
included building a finite element module to investigate the thermal stress
and evaluation of mechanical and physical properties of low melting brazed/soldered
systems. Experimental determinations of at-temperature mechanical properties
of braze systems. Process
planning Engineer, Motor Industries Company, Bangalore April 1989 - April 1991 (M/s
Robert Bosch Gmbh, Germany) Manufacturing/Process
Planning Engineer: Product design, planning and evaluation of auto electrical
products. - In charge of setting up the manufacturing systems for production
of starters, alternators and other electo-mechanical products. Established
various Statistical Process Control (SPC) stations in production lines
of starters, alternators, spark plugs and fuel injection equipment. Certifications
Optical Communications: Technology
and Applications, Bell Labs, DWDM
Systems: Bell labs Mid-Management
Course in Georgia Tech, Atlanta, GA. UNIX
Training at Gwinnet Tech., Lawrenceville, GA. ORACLE
7.3(SQL and PL/SQL) AND SAP R/3 (MM) at Coresoft, Atlanta, GA. Computer
Skills Systems: IBM PCs, Windows, NT, UNIX, and VMS 8800 Packages:
MS Office, MS Access, Oracle 7.3, SAP R/3(MM). Three
Publications "Stress
Analysis of Multilayer Multichip Module etc.------presented at International
conference in Japan 1992. "Machinability
of Aluminum Alloys etc.-------Tennessee Technological University, USA. "AuSn brazing for hermetic seal ring attachment etc.------Technical Symposium at the International Society of Hybrid Microelectronics, North Florida Chapter, Orlando, Florida, USA, March 1994.
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