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Process
Development Engineer, 04388
Industry:
Optical - Thick and Thin Film - packaging and Opto electronic devices
Resides:
Pennsylvania
Salary:
Open
Relocate:
Yes
On
the Market:
RECRUIT
Objective
A challenging engineering / managerial position in a engineering environment.
Education:
Master of Science in Mechanical Engineering.
June 1995
Florida International University, Miami, Florida.
Thesis: Characterization of gold-tin alloys as a braze material in Multichip
modules.
Earned 100% expenses
Bachelor of Engineering in Mechanical Engineering.
May 1989
Summary of Qualifications Industrial
. 9.5 years of Industrial experience
. Experience in all phases of process development, manufacturing, electronic
packaging (7.5 years) & mechanical design and process planning (2
years)
. Expertise in processes development in the area of MCM, high accuracy
die attach, SMT and PTH technology
. Strong Management skills.
. Experience with ISO-9002, MRP and Inventory control.
Academic and Research
. M.S in Mechanical Engineering.
. Knowledge of various technologies like thick film, thin film and MCM's
. Knowledge of software design and development
. Publications (see below)
General
. Excellent communications skills
. Work well individually and in team environments
Experience
Process development Engineer, (Company)
October 2000 - August 2002
Establishing processes for 10G bit Transponder product including sub contractors
for MCM packaging and Opto electronic devices (both active and passive
devices). Chip and wire including both epoxy and eutectic die attach
processes. Establishing supply chain and assembly line processes for small
/ medium volume manufacturing of 10 Gbit transmitter and receiver product
lines. Very proficient in high accuracy ((1 micron) eutectic die attach
and epoxy die attach processes.
Product Engineer, Lucent Technologies Inc. Breinigsville, Pa.
April 2000 - October 2000
Responsible for yield, quality, productivity of WaveStar 400G Erbium Doped
Fiber Amplifier (EDFA). Responsible to ensure products conform to customer
specifications, with in-process controls of different processes. Responsible
for WaveStar 400 G product line, from kitting to shipping including, assembly,
testing in automated DWDM test platform. Handling customer complaints,
in-process failure mode analysis, leading to assembly / design improvements
of the product. Product revenue: 50 million
Process development Engineer, Lucent Technologies Inc. Breinigsville,
Pa.
April 1999 - April 2000
Responsible for developing process used in assembly of fiber amplifiers.
Establishing manufacturing test / assembly systems for testing erbium
doped fiber amplifiers.
Group Leader-Engineering Manager, Vitel Technologies Inc. Tucker Ga.
June 1998 - April 1999
($8million - company: Subsidiary of American Megatrends Inc.)
Responsible for Engineering, SMT, Stockroom and Document control departments.
Supervising Engineers and technicians in the areas of process development,
equipment programming and processes for product flow through the entire
factory, with cost and quality constraints. Responsible for machine maintenance
program for the factory. Responsible for SMT production supervisors for
3 shifts of production. Developed a cost model for products.
Achievements: Maintained a consistent yield of 95% through the factory.
Reduced in-process WIP by almost 50% by incorporating continuous flow
production and substantial reduction in cycle time.
Senior Process Engineer :Vitel Technologies Inc. Tucker Ga.
Aug 1996 - June 1998
Responsible for setting up electronic manufacturing assembly line operation
including factory automation for manufacture of printed circuit board
assembly using SMT / PTH technologies. Installed surface mount assembly
line worth over $2.5 million. Setting up various processes, process capability
studies (Cp. & CpK.) using SPC tools, solder joint evaluation using
x-ray and micro-section analysis. Was responsible to get OEM approval
for the factory processes, for high volume production.
Process Engineer, Vitel Technologies Inc. Norcross Ga. June 1994 - Aug
1996
Responsible for setting up processes for new product introduction, prototype
development and production releases. Was single point of contact for customer
accounts to take the product from "quote to cash". Work involved customer
quotes, prototype, process development and process documentation. Processes
included stencil ordering, glue process development, SMT equipment programming
and development of reflow and wave solder process. Achieved greater than
95% yield @ ICT for products
Research Assistant Florida International University, Miami, Fl.
Sept 1991 - June 1994
Design of hybrid proto's circuits using Thick and Thin film technology.
Work involved managing a Hybrid Lab equipped with a screen printer, ball
bonder, firing furnace and vacuum systems required in thin film deposition
techniques like PVD, CVD, ion implantation and cluster beam deposition.
Proficient in using analytical tools like Diffractometer, SEM, TEM, Dilatometer,
Thermal Analysis equipment (DMA, DSC & TGA) and Acoustics.
Thesis during Master's: Optimizing materials and design for hermetic sealing
enclosures compatible with Multi Chip Module (MCM) processing - The work
included building a finite element module to investigate the thermal stress
and evaluation of mechanical and physical properties of low melting brazed/soldered
systems. Experimental determinations of at-temperature mechanical properties
of braze systems.
Process planning Engineer, Motor Industries Company, Bangalore
April 1989 - April 1991
(M/s Robert Bosch Gmbh, Germany)
Manufacturing/Process Planning Engineer: Product design, planning and
evaluation of auto electrical products. - In charge of setting up the
manufacturing systems for production of starters, alternators and other
electo-mechanical products. Established various Statistical Process Control
(SPC) stations in production lines of starters, alternators, spark plugs
and fuel injection equipment.
Certifications Optical Communications: Technology and Applications,
Bell Labs,
DWDM Systems: Bell labs
Mid-Management Course in Georgia Tech, Atlanta, GA.
UNIX Training at Gwinnet Tech., Lawrenceville, GA.
ORACLE 7.3(SQL and PL/SQL) AND SAP R/3 (MM) at Coresoft, Atlanta, GA.
Computer Skills
Systems: IBM PCs, Windows, NT,
UNIX, and VMS 8800
Packages: MS Office, MS Access, Oracle 7.3, SAP R/3(MM).
Publications
"Stress Analysis of Multilayer Multichip Module (MCM-D) structures using
the series solution of Elasticity Theory" (Names) presented at International
conference in Japan 1992.
"Machinability of Aluminum Alloys with varying Zinc content" (Names) presented
at Tennessee Technological University, USA.
"AuSn brazing for hermetic seal ring attachment to post processed MCM-D's"
(Names) presented at Technical Symposium at the International Society
of Hybrid Microelectron |
