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Flexible Encapsulating Resins
Manufacturing News Center
Cranston, RI --January 15, 2004-- Adhesives, potting compounds,
and coatings that are widely used in the electronic, electrical, aerospace,
construction, and decorative industries.
Electronic grade, low viscosity epoxy potting and encapsulating resin
forms a bubble-free glass-like finish when cured. Called 20-3001, the
resin has a 1:1 mix ratio. Lack of fillers makes it an ideal material
for meter, mix, and dispense equipment.
Called 20-2353, FLEXIBLE POLYURETHANE POTTING & ENCAPSULATING COMPOUND,
this two part system is engineered to provide low stress on electronic
components and to resist moisture. 20-2353 provides excellent hydrolytic
stability, low moisture permeability, a low glass transition temperature,
and low stress on sensitive components.
Called 20-3651\40, this is a filled epoxy casting, potting, and encapsulating
resin system. This is a lower viscosity version of the 20-3651. This system
exhibits excellent physical, thermal, and electrical insulation properties.
20-3651\40 is easily machined and exhibits outstanding adhesion to metals,
ceramics, and plastics.
Stop by and visit Epoxies, Etc... - See more from the leading resin formulator
of epoxy, urethane, and silicone systems - Call 1-800-EPOXIES
Free samples are offered.
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Source: Epoxies, Etc... 21 Starline
Way, Cranston, RI 02921 USA
Phone: 401-946-5564 Fax: 401-946-5526
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