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July 14, 2005 Semiconductor Equipment Manufacturers Get Help Seattle, WA, USA--(Jobwerx News)--The GE technology team in Kobe, Japan,
to offer custom wafer heater assemblies for semiconductor equipment
manufacturers. To help optimize the performance of heaters and electrostatic chucks
in chip-making equipment, GE's Quartz business announced an integrated
heater assembly platform based at the company's new laboratory in Kobe,
Japan. These custom assemblies - a critical subsystem of semiconductor
equipment manufacturers' wafer chambers - combine customer-specific
mechanical, electrical, and thermal engineering with GE's advanced chemical
vapor deposited (CVD) ceramic heaters and e-chucks. By considering thermal,
plasma, mechanical, and electrical boundary conditions of the OEM's
chamber, GE's new integrated design process helps optimize the performance
of the entire system.
According to Chris Intihar, GE product manager, Wafer Processing, “GE
has designed a new heater assembly platform with the customer's needs
in mind. GE's Quartz business is the only known supplier to provide
forward integration that will help semiconductor equipment firms improve
the performance of the entire wafer chamber, while helping to maximize
their internal engineering resources. Our Kobe lab offers sophisticated
design and testing capabilities and a dedicated technology team to help
customers expedite their projects. To accelerate this iterative design
process, we are leveraging our ceramics materials expertise from GE's
Global Research Center in Niskayuna, N.Y., and our advanced predictive
engineering and modeling capabilities from our team at GE's John F.
Welch Technology Center in Bangalore, India. Our U.S. plant at our Strongsville,
Ohio, world headquarters and our Japan plant near Himeji City, also
play an integral part of the design and manufacturing process.” The GE technology team at Kobe will deliver complete heater assemblies
featuring custom heaters, e-chucks, and its industry-standard quartz
materials. GE heaters and e-chucks are mechanically and thermally more
robust than sintered ceramic alternatives. They enable temperature ramp
rates exceeding 10 C/second with maximum temperatures up to 1,300 C,
and precise temperature control, generally within +/- 1 percent. These
material performance advantages translate into increased throughput,
greater process flexibility, and improved wafer yields for semiconductor
equipment OEMs.
The Kobe facility, located in the Kobe International Business Center,
is equipped with a Class 1000 (measured at 0.3 micron particulate level)
or Class 100 (measured at 0.5 micron particulate level) clean room,
thermal modeling capability, two test chambers capable of generating
plasma and measuring electrostatic clamping force, multiple heater power
supplies, and infrared cameras.
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