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Moldflow Ships Moldflow Plastics Advisers 7.0; New Modules Provide Powerful New Analysis Capabilities

Manufacturing News Center

Extending Moldflow's lead in simulation technology for injection molded plastics, MPA(R) 7.0 now includes two new add-on modules - Performance Adviser and Cooling Circuit Adviser. These two new modules provide powerful new analysis capabilities to allow users to determine the efficiency of their mold cooling circuit designs and predict the likelihood of molded part warpage. Additional enhancements allow users to better select materials, design more efficient molds, collaborate with plastics CAE experts and increase productivity.

According to Moldflow Plastics Advisers user Steve Steffes, senior design engineer at Certainteed Molded Products, "Moldflow has been very responsive to customer requests for product enhancements. The material orientation feature that was added to MPA 7.0 helps us to optimize part strength. By carefully evaluating the material orientation patterns, we are able to place gates or modify part designs to maximize part strength."

Pricing and availability

MPA 7.0 is available now. For sales and product information, contact your local Moldflow representative.

About Moldflow Corporation

Moldflow (NASDAQ: MFLO) is the leading global provider of automation and optimization software solutions for the plastics injection molding industry. Companies use Moldflow's complete suite of products to address plastic part design issues at the earliest possible stage as well as to maximize productivity and profitability on the manufacturing floor. Moldflow's collaboration with academia, industry, and customers around the world has led to a reputation for constant innovation in the complete design-to-manufacture process. Headquartered in Wayland, Massachusetts, Moldflow has offices and research and development centers in the United States, Europe, Australia, and Asia.

Note to editors: Moldflow, Moldflow Plastics Advisers and MPA are trademarks or registered trademarks of Moldflow Corporation or its subsidiaries worldwide. All other trademarks are properties of their respective holders.

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Source: Moldflow

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