2007-11-15 Manufacturing News

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New Ferro Electronic Packaging Materials unit

Ferro Corporation forms Electronic Packaging Materials business unit to more efficiently serve the electronics manufacturing markets.

The Electronic Material Systems unit of Ferro Corporation, Cleveland, Ohio, USA has combined several sub-business units into the newly formed Electronic Packaging Materials (EPM) unit. The new EPM unit was formed to make it easier for customers to buy both performance enhancing engineered formulations and cost effective materials used to produce hybrid circuits, microelectronics, advanced packaging, and devices.

"We've combined several product-focused businesses to provide a full range of options to meet all of our electronics packaging customers' needs with a single point of contact," said Jeffrey Edel, Business Director and General Manager, Ferro Electronic Material Systems. "EPM's focused approach simplifies providing what customers need to gain an advantage, regardless of the product type."

Ferro has a long track record of providing market-leading systems of matched engineered materials, as well as applied technology expertise to help integrate products into customers' manufacturing processes. These products are often customized for specific applications. In addition, many customers make their own formulations in-house, or use certain Ferro materials for particular functions. EPM was created to serve the full range of these customer needs.

Engineered formulation product lines improve product performance and/or production efficiency in specific customer applications. These product lines include thick film conductive pastes and matched material systems comprised of resistor pastes, dielectrics, and overglazes for hybrid IC and metal core substrate applications, as well as high-performance, low temperature ceramic co-fired (LTCC) tape with a gold-based matched materials system.

Ferro's cost-effective discrete materials provide building blocks for customers' electronic materials formulations. Electronic Packaging Materials offers electronic and technical glasses, and LTCC formulated powders. Ferro also manufactures binders and metal powders, as well as custom and proprietary electronic materials.

Ferro Electronic Material Systems products include advanced packaging and thick film conductors; metal pastes and powders for solar energy applications; chemical mechanical planarization (CMP) slurries for semiconductors and advanced integrated circuits; dielectrics used in chip components and multilayer ceramic capacitors (MLCC); and surface finishing materials for LCD, hard disk, and ophthalmic polishing.

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