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2007-06-12 News Release

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RFID transponder molded in plastics component

New RFID transponder generation makes it possible to integrate a three-dimensional directional antenna into the plastics component.

In the retail trade and in the field of merchandise management as a whole, radio tags or RFID transponders (RFID = Radio Frequency Identification) are regarded as the technology of the future. To simplify and speed up logistical processes, these tags are attached to containers, boxes and crates to provide information on their contents, origin and condition.

Recently, HARTING Mitronics AG succeeded in increasing the efficiency and detection range of these transponders quite significantly. The company, which is based in Biel, Switzerland, manufactures its new transponder generation with the aid of Laser Direct Structuring (LDS) as a three-dimensional plastics printed circuit, also known as a molded interconnect device (MID). They are made of Pocan DP T7140 LDS from LANXESS. "This PET+PBT plastics blend is tailor-made for both the LDS process and the MID technology," explains Ralf Jantz, MID expert in the Semi-Crystalline Products business unit.

The combination of LDS and MID makes it possible to integrate a three-dimensional directional antenna into the plastics component. Via this antenna, the RFID transponders - unlike conventional radio tags based on plastic film (smart labels) - can be written and read from a range of up to five meters, even when close to metals and liquids. "Consequently, our RFID transponders can also be attached to metal and liquid containers or integrated into demanding production processes. We therefore see enormous opportunities in logistics, in the internal tracking of production goods, in process control and in spare parts management," explains Jörg Hehlgans, head of Marketing & Sales at HARTING Mitronics AG.

Laser Direct Structuring* is a particularly innovative method for manufacturing MIDs. It was invented by LPKF Laser & Electronics AG located in Garbsen near Hanover (LPKF-LDS**), and enables conductive patterns to be applied easily, inexpensively, and flexibly without the use of etching chemicals onto three-dimensional MIDs. The process uses thermoplastics to which an organometallic complex has been added. After injection molding the plastics, a laser "burns" a high-resolution conductive pattern onto the three-dimensional part. The areas that have been activated are subsequently provided with copper, nickel and/or gold conductive tracks in electroless metalizing baths.

The three-dimensional antenna structure is also applied in this way to the RFID transponder. In all, the entire subassembly consists of only three parts: a half-housing with the antenna on the inside, the lid and a chip. The information is stored on this chip, which is attached to the conductive circuits by wire bonding. The two halves of the plastics housing are joined together by vibration welding. The result is a hermetically sealed structure that protects the inside of the RFID transponder from external influences such as water and dust. The component thus conforms to IP 54 to 67 and IP69K (IP = International Protection).

Pocan DP T7140 LDS - like all polyesters developed by LANXESS for laser direct structuring - is compatible with all the steps in the LDS process, from plastics injection molding and lasering to metallization and possible subsequent soldering. It has a heat deflection temperature (Bf) of 250 °C and is therefore particularly suitable for applications subjected to heavy thermal loads. It can also cope with the temperatures of reflow and vapor phase soldering. "Practical trials confirm that the material can also withstand the temperatures occurring in the soldering of electronic parts with lead-free solder. A soldering process of this kind is needed for many MID applications," added Jantz.

The Semi-Crystalline Products business unit belongs to the Engineering Plastics segment of LANXESS, Leverkusen, which achieved total sales in fiscal 2006 of EUR 1,708 billion.

* The use of Laser Direct Structuring for the production of MIDs may be dependent on the protective rights of third parties, for example EP 1191127 B1, EP 1274288 und EP 0 917597 B1.

** LPKF-LDS is a registered trademark of LPKF Laser & Electronics AG.

Read a recent press release about - New LNP X-Gen Starflam Z270 family of fiber-reinforced polyamides from GE Plastics supports compliance with the European Union’s Waste Electrical and Electronics Equipment (WEEE), Restriction of Hazardous Substances (RoHS) regulations, and other environmental requirements.

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