Moldflow, the leading global provider of automation and optimization software, enabling hardware and hot runner process control solutions for the plastics injection molding industry, recently launched design analysis software that will help manufacturers achieve more advance packaging designs in less time.

MPI 5.0 software, provides processors more options and focuses on 3D technology, as well as, pre- and post-processing productivity improvements. The software offers a database with more than 7,800 materials characterized for use in plastic computer aided engineering (CAE) analysis. MPI 5.0 offers 19 distinct modules that can be used to simulate nine unique moulding processes.

New 3D innovations help users simulate the gas-assisted injection molding process and evaluate the effect of polymer or metal inserts on the cooling and warpage of the plastic part. In addition, the software helps predict core deflection, packing and warping of thermoset materials and dynamic paddle-shift in the microchip encapsulation process.

Moldflow’s collaboration with academia, industry, and customers around the world has led to a reputation for constant innovation in the complete design-for-manufacture process. Headquartered in Wayland, Massachusetts, Moldflow has offices, manufacturing, and research and development centers in the United States, Europe, Australia, and Asia.

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