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Thermally Conductive Metal Composite

A cost-effective process allowing tight tolerances without machining and provides high-volume assembly yields for electronics packaging applications




Packaging World
Is the leading publication covering the business of packaging.... more info

Ceramics Process Systems Corporation, CPS, is the World Leader in providing AlSiC thermal management materials and electronic packaging designs and products for the microelectronics and power electronics industries.

AlSiC (Aluminum Silicon Carbide), a metal-matrix composite from CPS, is said to be ideal for thermal management engineering of high-flux LEDs, such as signal lamps, back lighting for signs, low-profile luminaries, task lighting, and display lighting.

The material's high thermal conductivity (200 W/mK) lets it achieve maximum brightness in LED lamps at the lowest possible operating temperature. Unlike copper and aluminum metals that have high thermal-expansion values, AlSiC has a low coefficient of thermal expansion (CTE). This minimizes thermally induced stress and reduces failures of delamination and cracking. This reduction improves LED reliability. With a compatible CTE value, the need for thermal stress compensating interface layers is also eliminated. A net-shape fabrication process produces the material and fabricates product geometry, including throughhole and threaded-hole features. This cost-effective process allows tight tolerances without machining and provides high-volume assembly yields.

The casting process also simplifies use of high thermal conductivity inserts (>1,000 W/mK) for thermal dissipation.

The CPS AlSiC fabrication process not only produces the composite material but also fabricates the product geometry for a cost-efficient, highly manufacturable product. This process allows competitive pricing with other material choices while providing exceptional thermal management in a light-weight, high-strength, high-stiffness product.

See more at CPS, including a non-thermoplastic, injection molding process for the forming of ceramic and metal particulate bodies. The process has many advantages over thermoplastic injection molding processes.

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Ceramics Process Systems, 111 S. Worcester St., Chartley, MA 02712, Contact: CPS Corp. Mark A. Occhionero - Sales and R&D Sr. Scientist, Tel: 508-222-0614 ext. 42,
E-mail: marko@alsic.com

You can see CPS at the next IMAPS 2005 Trade Show in Philadelphia

 

 

 

 

 

 

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